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The effect of microstructure and purity on the native oxidation of Cu was studied by using angle-resolved X-ray photoelectron spectroscopy (AR-XPS) and spectroscopic ellipsometry (SE). A high quality copper film prepared by ion beam deposition under a substrate bias voltage of −50V (IBD Cu film at V s =−50V) showed an oxidation resistance as high as an ultra high purity copper (UHP Cu) bulk,...
The thickness dependence of the resistivity for Cu films deposited by ion beam deposition (IBD) was evaluated using Fuchs-Sondheimer (F-S) model for electron surface scattering and Mayadas-Shatzkes (M-S) model for electron grain boundary scattering. For fitting the F-S and M-S models to the experimental data, the approximate equations proposed in both models were discussed and it was confirmed that...
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