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Copper films were deposited in supercritical carbon dioxide through hydrogen reduction of Cu(hfac) 2 at pressures of 10-15 MPa and temperatures of 250-400 o C. Preferential deposition on conductive substrates was observed. X-ray photoelectron spectra of the films showed pronounced metallic Cu peaks and trace level of impurity elements. It was also found that the films were (111)-oriented...
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