The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
SiC-nanoparticle-mixed Sn58Bi solders were successfully produced by electroplating and the mechanical and microstructural properties of Sn58Bi+SiC solders were observed and analyzed in this study. Dispersed SiC nanoparticles by ultrasonic horn were added into Sn-Bi plating solution. With the SiC added Sn-Bi plating solution, solder bumps were electroplated. After electroplating, the solder bump specimens...
In this study, Sn-0.7Cu solder alloy was reinforced with Al2O3 (50 nm) and ZrO2 (45 nm) nano particulates to form Sn-0.7Cu/Al2O3 and Sn-0.7Cu/ZrO2 composites. The volume percentge of the Al2O3 and ZrO2 nanoparticulate reinforcement was kept at 1.5%. The composites were synthesized using powder metallurgy technique assisted with microwave sintering and incorporating hot extrusion as secondary processing...
Lead free solders with Sn-Ag-Cu (SAC) alloy compositions are now widely used in the electronics industry. Further enhancement of SAC solders by small addition of a forth element is aimed to improve the solder mechanical properties and the solder joint properties at the intermetallic bond interfaces. The addition of Ce to SAC solder with an alloy composition of Sn.3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) shows...
Poor deformation behavior of commercial polycrystalline Ta sheet used for Sn diffusion barriers in Nb3Sn composite superconductors leads to the use of more Ta than may be necessary in these conductors, and to strand fracture during wire drawing. These problems arise because of nonuniform deformation of the Ta layer when co-drawn with Cu. The origin of the problem resides in the microstructure of the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.