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For recent VLSI circuits, the clock frequency and integration density have continuously increased. Thus, accurate estimate of the per-unit-length resistance and inductance of interconnect has become important for maintaining the signal integrity [1]. In order to design for the transmission lines successfully, it is necessary that correctness of the selected formulas or numerical methods can take into...
A semianalytical full-wave formulation is used to analyze a narrow gap in a microstrip line. The analysis assumes that the length of the gap is small compared to the strip width, but allows for an arbitrarily high frequency. The formulation accounts for radiation from the gap into space and into surface waves. Based on this formulation, the scattering parameters of the gap are obtained along with...
A switch Application Specific Integrated Circuit (ASIC) chip implemented in six-substrate layers for low cost design which has more than 1000 pin-count. This paper deals with the electrical design of the high density package, including transmission characteristics of the key signal lines, crosstalk between signal lines, the coupling between neighboring power pins, DC IR drop and AC input impedance...
This paper discusses the design of a 60 GHz low noise amplifier (LNA) using a standard low power SOI CMOS process from ST Microelectronics. First, we outline the technology as well as the mm-wave design challenges. Using recent work on coplanar waveguide (CPW) modeling, we describe how it's possible to use parametric, 3D electromagnetic simulation to complete or replace analytical models of on-chip...
Continuous scaling, necessary for enhanced performance and cost reduction, has pushed existing CMOS materials much closer to their intrinsic reliability limits, forcing reliability engineers to get a better understanding of circuit failure. This requires that designers will have to be very careful with phenomena such as high current densities or voltage overshoots. In addition to the reliability issues,...
In this paper, the processes associated with the electrodeposition of Selenium on Au substrates from nitric acidic solutions were investigated by combined electrochemical impedance spectroscopy (EIS) and cyclic voltammetry (CV) measurements. The analyses reveal that H2SeO3 in the solution is firstly adsorbed on the surface of Au electrode during cathodic polarization and subsequently reduced to Se...
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