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The electrochemical deposition behaviors of Pd-Ni bimetal on different matrix materials were studied by means of the preparation of Pd-Ni/GC, Pd-Ni/foam-Ni and Pd-Ni/Ti electrodes. The effect of the matrix materials to the electrocatalytic activity of electrodes was investigated. CV results reveal that hydrogen absorbability of Pd-Ni/Ti electrode was obviously higher than the Pd-Ni/GC and Pd-Ni/foam-Ni...
Polyaniline/graphene nanocomposite (PANI/G) was synthesized by an in situ polymerization procedure. The microstructure of PANI/G was characterized to be a mixture of PANI nanowires and graphene sheets by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and Energy Dispersive X-Ray Fluoresence Spectrometer (EDX). PANI/G was used to modify glassy carbon electrodes to detect...
The concept of column-less SEM using field emitter with a multi-stacked electrostatic lens (multi-gate FE) is proposed. To realize the column-less SEM, we revised fabrication process of the multi-gate FE.
The aim of this work is to develop a high electrocatalyst system for hydrogen evolution utilizing palladium electrode ensemble (Pd-NEE). The work proposes a novel fabrication process to fabricate Pd-NEE using electroless deposition of Pd in a thin porous polycarbonate (PC) film for high performance electrochemical detection. Scanning electron microscopy (SEM) in conjunction with energy dispersive...
An amperometric immunosensor based on a multiwall carbon nanotubes (MWCNTs) embedded conducting polymer, poly 5, 2': 5', 2"-terthiophene-3'-carboxylic acid (pTTCA), was developed and the sensor was applied for the detection of IgG. The presence of MWCNTs could enhance the conductivity of pTTCA polymer film and consequently, the overall performance of the immunosensor developed was also improved...
We evaluated thermal conduction of a single carbon nanotube (CNT) in air. Heating the end of the CNT locally by a microheater, we measured temperature dependence of electrical resistance of the single CNT. First, we fabricated the microheater for local heating and four electrodes for electrical resistance measurement on a Silicon on Insulator (SOI) wafer and made a gap for heat insulation. The effectiveness...
Both carbon nanotubes (CNTs) and polypyrrole (PPy) have been investigated as materials for manufacturing high charge-transfer electrodes due to their outstanding performances. In this work, PPy and chemically-functionalized multi-walled CNTs (COOH-MWCNTs) and single-walled CNTs (COOH-SWCNTs) were electrodeposited from an aqueous solution to form a nanocomposite on the surface of platinum metal electrodes...
Optimized growth of segmented nanorods comprised of gold (Au) segments (Au-gap-Au) using electrochemical wet etching method is reported. The nanorods were fabricated using alumina (AAO) template of thickness 100 ??m and pore size of 200 nm. A thin silver (Ag) sacrificial layer was grown on one side of the AAO template to act as cathode. Electrochemical process was used to grow Au segments sandwiching...
We have fabricated vertical nanogap electrode devices based on Silicon-on-Insulator (SOI) substrates for investigating the electronic transport properties of long, conjugated molecular wires. Our nanogap electrode devices comprise smooth metallic contact pairs situated at the sidewall of an SOI structure, obtained by selective recess-etching a few nanometers thin buried oxide layer and subsequent...
Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed the deposition of NiFe on Cu substrates and the crystallite size calculated from Scherrerpsilas formula...
High voltage carbon and refractory metal electrodes employed in devices used in space, such as ion thrusters and traveling wave tubes, can be easily damaged by electrical breakdown and arcing events. Modification of the electrode surfaces due to these events can impact the voltage hold off capability of the surfaces, which could lead to additional arcing, further damage, and the potential for device...
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