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A robust verification methodology for 3D-IC design is presented. This approach addresses the challenge of delivering a familiar verification solution with minimal disruption to existing design and verification flows. The proposed method provides a generic framework that allows users to specify their own 3D-IC design stacks for verification with TSVs, flip-chips or wire-bonded dies.
Today's SoCs/SIPs face numerous design challenges as increased integration of system components on a single die stretches the limits of technology and design capacity. 3D integration, where multiple dies are stacked and interconnected in the vertical dimension using through-silicon vias (TSVs), is probably the best hope for carrying ICs along (and even beyond) the path of Moore's law in the 21st century...
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