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Large and complex system-on-chip devices consisting of many processor cores, accelerators, DSP functions and many other processing and memory elements are becoming common in the semiconductor industry nowadays. To communicate, these processing and memory elements need to have a network-on-chip (NoC) that is scalable enough to support large number of elements and large bandwidth among other requirements...
The emergence of the third dimension in Network-on-Chip (NoC) design as a quest to improve the quality of service (QoS) of on-chip communication has evolved with enormous interest. However the underlying router architecture of 3D NoCs have more area footprint than 2D routers. In this paper, we investigate heterogeneous 3D NoC topologies with the focus on finding a balance between the manufacturing...
Combining the benefits of 3D IC and Network-on-Chip (NoC) schemes, provides a significant performance gain for 3D stacked architectures. In recent years, Through-Silicon-Via (TSV), employed for inter-layer connectivity (vertical channel), has attracted a lot of interest since it enables faster and more power efficient inter-layer communication across multiple stacked layers. However, the area overhead...
In this paper, we proposed a dual flit transmission rate (DFTR) router architecture according to the property of short distance for the inter-wafer links for 3D Network on Chip (NoC). The equivalent bandwidth of the inter-wafer links can be N times wider than that of the intra-wafer links, since flit transmission rate in vertical direction can be N times fast than that in the horizon direction. Thus,...
In the context of the emerging 3D integration paradigm, chips are built as stacks of several (likely heterogeneous) 2D layers. The topology of their communication network is quite irregular, mainly due to the different topologies of the 2D layers and the partial vertical connection between these layers. In this paper, a reconfigurable inter-layer routing mechanism (RILM) for such topologies is proposed...
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient network on chip (NoC) interconnect for a 3-D SoC that meets not only the application performance constraints but also the constraints imposed by the 3-D technology is a significant challenge. In this paper, we present a design...
Three-dimensional integrated circuits, where multiple silicon layers are stacked vertically have emerged recently. The 3DICs have smaller form factor, shorter and efficient use of wires and allow integration of diverse technologies in the same device. The use of Networks on Chips (NoCs) to connect components in a 3D chip is a necessity. In this short paper, we present an outline on designing application-specific...
Three-dimensional (3D) silicon integration technologies have provided new opportunities for Network-on-Chip (NoC) architecture design in Systems-on-Chip (SoCs). In this paper, we consider the application-specific NoC architecture design problem in a 3D environment. We present an efficient floorplan-aware 3D NoC synthesis algorithm, based on simulated allocation, a stochastic method for traffic flow...
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on Chip (NoC) interconnect for a 3D SoC that not only meets the application performance constraints, but also the constraints imposed by the 3D technology, is a significant challenge. In this work we present a design tool, SunFloor...
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