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Wide band gap semiconductors have becomevery attractive for power electronics because of their excellentproperties at high power and high junction temperaturesabove 300°C. However, the maximum operation temperaturesof conventional packaging materials, like tin-based solders oreven tin-lead solders, are limited to around 220°C. Thus, a newpackaging material with a higher melting temperature must bedeveloped...
Sintered nanosilver paste die attachment is an emerging technology for wide bandgap semiconductors. Apart from the excellent electrical connection and thermal dissipation abilities of the sintered joint, this technology also features its low bonding temperature below 300 °C and high working temperature up to 700°C. However, this technique usually comes up with some problems if we avoid using high...
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