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This paper describes the degradation properties of bisphenol A type epoxy with a carboxyl-terminated butadiene-acrylonitrile (CTBN) and nano-clay. For evaluation of degradation by radiation, gamma rays of 500 kGy, 1000 kGy, and 1500 kGy were used to irradiate the samples at the dose rate of 8 kGy/hr. The degradation properties of the gamma-ray irradiated samples were measured using a thermogravimetric...
In this research, epoxy resin was modified by amine-terminated polyimide (ATPI) prepolymer for improving both thermal and mechanical properties of electronic packaging materials. The ATPI was synthesized with polyester and pyromellitic dianhydride (PMDA), p-toluene sulphonic acid (PTSA) as catalyst and characterized by FT-IR spectrum and DSC. The ATPI modified epoxy resin (AME) was cured by 4, 4-diaminodiphenyl...
With fast development of electronic packaging, the conductive adhesives were widely used in surface mount and chip interconnection. As an alternative to solder, it has many advantages, such as low processing temperature, less environment contamination and fine pitch capability. However, conductive adhesive joining technology also simultaneously faces a lot of challenges. The major problem of current...
Despite the introduction of newer die attach adhesive material such as die attach films, conventional die attach epoxy remains to be the most important material for die attach process in semiconductor packaging. In response to the demand for high bonding strength and thermal dissipation while maintaining good manufacturability, the requirements on the behavior and characteristics of the epoxy are...
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