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Bi-material interface and multi-layer systems are widely observed in modern microelectronic applications. When the external load reaches a critical level, the crack either extends along the interface or kinks out of the interface, and finally leads to the catastrophic failure. In fracture mechanics, stress intensity factor, mode mix ratio and strain energy release rate are normally used as parameters...
This paper describes fracture mechanics simulation with a partitioned iterative coupling method. Here an analysis object, i.e. a cracked structure, is decomposed into two domains, i.e. the one with a crack and the other without crack, both of which are analyzed separately. The size of the cracked domain is smaller, whereas the other domain is much larger. Fracture mechanics analysis is performed only...
This paper introduces through the Ansys parametric design language (APDL) to establish finite element model containing surface semielliptical crack expansion of power station heat exchange tube. The type of finite element is used in this program is isoparametric degradation singular element, whice simulates crack stress singularities. And the crack front is token discrete. Based on this kind of finite...
Pipe plays an important role in the petrochemical industry. Developing pipe testing technique can avoid or decrease accidents and is an important guarantee for the safety service of pipe. In this paper, a method is presented to identify crack location and size, which is based on the finite element method (FEM) and model modification. Pipe structure is dispersed into a series of nested thin-walled...
Stress intensity factor of thermal fatigue crack was calculated within one cycle by using finite element method in consideration of the multi-linear kinematic hardening characteristic of a material. The affection of loading sequence to stress intensity factor was studied under circularly variational temperature by comparing to that in one cycle. The low temperature cycle can not affect the stress...
The parameters of adhesively bonding patch, which include patch materials, patch size, patch thickness, have been analyzed on the stress concentration factor and the stress intensity factor (SIF) thanks to the 3D finite element method (FEM) in the paper. The adhesive shear modulus and thickness are studied in this paper as well. The aluminum sandwich face panel is analyzed and the results show that...
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