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The press-pack IGBT (PPI) modules are characterized by design of double-sided cooling, solderless joint and wire-bondless contact. These features allows them to be utilized in the field where power density and reliability are demanding, especially in multi-MW wind turbine applications. However, owing to the press-pack structure, there is parasitic inductance which can't be neglected in the mechanical...
In this paper focus is to study various transition sub-intervals of an IGBT during switching events. The relationship of these transition duration with the switching voltage, device current and junction temperature is studied experimentally. This study is further extended to understand the effect of these time duration deciding the dead time between the switching of positive and negative devices in...
With the demands for increasing the power rating and improving reliability level of the high power IGBT modules, there are further needs of understanding how to achieve stable paralleling and identical current sharing between the chips. This paper investigates the stray parameters imbalance among parallel chips inside the 1.7 kV/1 kA high power IGBT modules at different frequencies by Ansys Q3D parastics...
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