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The method of the split cylinder resonator cavity (SCR) is used to characterize accurately and simultaneously in one temperature cycle, dimensional and electrical characteristics of the cavity and the electromagnetic properties of a dielectric material. To do this several modes are used, some to control the cavity and others to control the sample.
The transient process of filling the mold cavity in microelectronics packaging has been simulated applying the finite element method (FEM). The results have been compared to those of so-called dasiashort shotpsila experiments, in which the molding process is interrupted at predefined points in time. After determining the quantitative discrepancies between the simulation and the experimental results,...
In this paper the analysis of a microstrip antenna loaded with a double-negative (DNG) material is shown. The presented results can be applied easily to the design of planar antennas, arrays and frequency selective surfaces (FSS). The advance in planar radiating structure design using non-conventional material with the objective of size reduction is carried out. A DNG material realized with a periodic...
The effect of thinning down the chip thickness, will affect the stress pattern in the chip and causes the chip to deform locally when the thickness of the chip is thinner than a certain critical value. Such a local deformation may cause sharp gradient of residual stress around the solder bumps and thus, various failures. This paper shows that by considering the effect of solder bumps on a 50 mum chip,...
The MEM actuator is controlled by an external heat source, such as the heat gradients present in some electronic systems. As the substrate bottom is heated, the thermal expansion rises the membrane, which can be used as an actuator. The analysis was realized by means of mechanical and thermal properties of materials. We also present the effect of the physical dimensions of the walls and, thickness...
The power consumption and the matching will be the principal issues at the 32 nm node and below. In this context, Ultra-Thin Body devices are extensively studied for the end-of-roadmap CMOS. In this paper we present the SON technology, leading to the simple fabrication of sustained mono-Si nano-membranes over an empty tunnel, and discuss on the application of this process to build-up electronic devices...
Micro-indentation test with a micro flat-end cone indenter was employed to simulate micro embossing process and investigate the thermo-mechanical response of ceramic green substrates. The laminated low temperature co-fired ceramic green tapes were used as the testing material; the correlations of indentation depth versus applied force and applied stress at the temperatures of 2SdegC and 75degC were...
A novel compact coupled planar resonator (CCPR) based VCO (voltage controlled oscillator) using mode-coupling technique was developed in response to expensive high Ceramic and SAW resonators based signal source for wireless communications. One of the problems related to the conventional Ceramic/SAW based resonators (with high Q and low phase noise) is the challenge for integration in IC form. Instead...
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