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The failure of power converters is currently the main reason of stopping for wind turbines. The unpredictable nature of wind power flow causes temperature swings to the semiconductor devices, which leads to additional thermal stresses and, eventually, unexpected failures. A suitable way to avoid this is using condition monitoring systems, which detect the degradation of the devices and reduce the...
P-i-N Diode chip temperature is a significant indicator when evaluating the reliability of high power converters. Firstly, the limitation of the forward voltage drop for high power P-i-N diode thermal sensitive electrical parameter (TSEP) is explored. In conventional two-level converter, the commutation is occurred between upper and lower devices. By detailed analysis of the upper P-i-N diode reverse...
This paper deals with a method to derive the junction temperature of an IGBT while the device is in operation. In order to achieve this the gate-emitter voltage, the collector current and the collector-emitter voltage are digitized on the driver board. Due to the fact that material parameters vary with temperature, the waveforms of the switching transients vary with temperature, too. Thus, there is...
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