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As system performance requirements for high performance computing (HPC) systems become more demanding, the need to increase component packaging density to shorten interconnect distances becomes more stringent. One technique for accomplishing this requirement is to implement 3-dimensional heterogeneous integration of system components. In an earlier publication, we described the design of a processor-memory...
T-body connector is used in utility distribution system for interconnecting the distribution system cables which carry a high value of electric current. In the past a large number of failures occurred with the bolted T-body connector. The replacement of an existing connector with a new one is an expensive process. The root cause was assumed to be insufficient Installation torque, but it was unknown...
Various factors affect performance of evaporative cooling media. Many literature papers report on factors that affect performance of cooling pads that are used in greenhouse and poultry farming applications. There is a lack of literature data that discusses the effect of these factors for data center applications. Currently various types of cooling pads are used in many data centers. This paper addresses...
Good diagnostic tools are the base of a proper diagnosis and as a result of good treatment. The examination of disorders of the spinal cord or peripheral nerves requires a simple tests. These tests are called Quantitative Sensory Tests. To perform these tests typically a not very accurate tools are used. This inconvenience was the basis for the development of new diagnostic tools to perform the QST...
Combining the heat recovery technology of heat pipe and evaporative cooling technology, this article researched a heat recovery heat pipe-type indirect evaporative cooling air-conditioning unit and tested this unit. Based on analyzing we got main perfoprmance factors and best operation parameters. The best ratio of volume of secondary air and primary air is 0.8, the best water delivery is 0.322 m3/h,...
With the growing power dissipation of information and telecommunication equipments, more concerns should be put on the cooling issues due to the reliability and OPEX requirements. This paper describes a fast optimizing cooling solution for the existing CO/ DC. As an important analysis approach, CFD simulation aims to improve the heat dissipation condition and the energy saving. With the application...
A physical yet analytical phase change memory (PCM) model simultaneously accounting for thermal and electrical conductivities is presented. Due to the physics based nature of the model, the essential temperature from heating and cooling of PCM during operation is instantaneously updated. More importantly, the model can be applied to non-conventional circuit design technique. We show that for the first...
An inexpensive microelectronic environmental test chamber design is proposed that can vary the temperature with a range of greater than 10degC to 90degC. The chamber is capable of automating temperature cycling as well as automating the electronic measurements taken. Driven by thermoelectric devices, the chamber is exceptionally space efficient and flexible in use; occupying an area of less than 1...
The paper introduces an online performance test software for large capacity combined-cycle units. The software is composed of four parts, i.e. the integrated modular modeling software (IMMS), real time database software, client browser software and communication software. The results of the model are displayed in B/S mode on the userpsilas terminals. With IMMS, on-line performance calculating model...
Decreasing the length of thermoelectric (TE) module legs results in a significant increase in power density, both for cooling applications and electricity generation. However, this reduction also results in a significant increase of mechanical stress in the legs materials. Thus, it is important to implement an effective method to characterize the mechanical properties, such as mechanical spectroscopy,...
In deep submicron era, to prevent larger amount of SRAM from more frequently encountered overheating problems and react accordingly for each possible hotspots, multiple ideal run-time temperature sensors must be closely located and response rapidly to secure system reliability while maintaining core frequency. This paper presented a method to extract run-time temperature information from multiple...
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