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Reliability of thin metal films and multilayers with layer thickness ranging from micrometers to nanometers is becoming more and more important not only due to the rapid development of micro/nano technology, but also because of the demands for the fundamental research interests in small scale materials. In this paper, we will introduce the state-of-the-art progress in evaluation of fatigue reliability...
To increase memory bandwidth with minimum area overhead, the new concept of 3D-stacked memory structure consisting of a small sense amplifier shared with a few 3D memory cells has been presented. The 16 bit 3D-stacked TiO2 memory chip was fabricated and demonstrated. The estimated bandwidth per unit area of 3D-stacked memory in sub-65 nm CMOS technology indicates that the 3D-stacked memory has potential...
Advances in micromachining technology can facilitate the integration of SAW (Surface Acoustic Wave) devices and CMOS circuitry on IC scale substrate for Monolithic fabrication. The optimal design and performance of these filters can be reached by using new Smart materials. The key component in the structure of the SAW device is the piezoelectric materials used which depends mainly on some important...
Multilayer hybrid thin films consisting of alternating layers of organic and inorganic materials were fabricated with powder of copper-phthalocyanine (CuPc) and zinc selenide (ZnSe) by electron beam evaporator. The structural and optical characterization of multilayer hybrid thin film were carried out by using X-ray diffraction (XRD), atomic force microscope (AFM) and UV-Vis absorption spectroscopy...
This paper reviews atomic layer thermopiles - anisotropic coefficients of thermoelectric thin film materials - their description, research into new materials, and applications.
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