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This paper introduces a thermal design method for 3D integration, using stacked thermal chips consisting of 100 polysilicon heaters in a 30 mm by 30 mm area on each chip to verify thermal models. For each heater, two levels of thermal load can be selected. Thermal effects from hot-spots in stacked chips were measured and verified in simulation results. Through this investigation, thermal models with...
A GaN-on-Si power device is a strong candidate to replace power components based on silicon in high-end market for low-voltage applications, thanks to its electrical characteristics. To maximize opportunities of the GaN device in field applications, a package technology plays an important role in a discrete GaN power device. A few specialized package technologies having very lower stray inductance...
Scanning Thermal Microscopy (SThM) is a key technique for thermophysical property measurements with a submicrometric spatial resolution. The European project QUANTIHEAT “Quantitative scanning probe microscopy techniques for heat transfer management in nanomaterials and nanodevices” is centred around this technique. Project aims at solving the problems of thermal metrology at the nanoscale by delivering...
According to electronization for car, many units which have thermal sources are mounted in vehicle and some heated units are broken down in operation. This problem can be caused by a big accident. Because of this problem, heat generation of electronic unit is a big issue in a recent automotive business. Recently, most automakers and auto-parts suppliers always have been tried to rapidly predict or...
Failures may often occur in the packaged power terminals (PPTs) of the heater modules during harsh wafer baking process. The dominant failure factor is a high temperature. Hence, the performances of the PPTs should be explored under multiphysics environment to develop robust heater modules. In this study, FEA electrical-thermal-structural models of the PPTs are developed and experimentally validated...
Increasing energy demand and depleting fossil fuels make it imperative to shift to more efficient energy sources. Thermoelectric materials can convert waste heat into electrical energy by means of the Thermopower or Seebeck effect. Nanowires are promising candidates to increase the efficiency of thermo-electric conversion because their low dimensionality is predicted to increase the Seebeck effect...
A method for the determination of the thermal parameters of a cylindrical Li-ion battery by using heat flux measurements is analysed. The method for the determination of the thermal parameters, such as though-plane thermal conductivity and heat capacity, is based on the cylindrical cell battery model, which is explained in detail. The analysis of the applicability of the considered method and its...
Visible Light Communication is an emerging technology in Optical Wireless Communication where the Light Emitting Diodes (LEDs) are utilized for transmission of data. The luminance of the LEDs increases with the forward current; however, for high current levels the heat generated by non-radiative recombination of carriers increases the LED junction temperature, decreasing the efficiency and the lifetime...
In this paper an ultrasonic reflectometry approach to measure the thermal conductivity and temperature of a material by contact is presented. This device can be utilized for monitoring material properties during manufacturing, and robotic handling of objects. The sensor comprises an AlN piezoelectric ultrasonic transducer operating at GHz frequencies, situated on one side of a silicon chip. The transducer...
The mathematical model for temperature field analysis of the new hybrid magnetic bearing has been presented in the paper. The distributions of temperature which have been obtained from 2D and 3D simulations were compared with the results from the physical model testing of the hybrid bearing.
Increasing availability of thermal imaging technology made it possible to carry out thermal quality control of vegetables and fruits in the process of sorting them. For the effective management of thermal control, it is necessary to ensure its optimal regimes, which are largely determined by the power and time of the thermal impact. In order to choose these parameters it is necessary to know the thermophysical...
Composites of Low-density polyethylene (LDPE) containing 1–5 wt% of Si/SiO2 core/shell nanoparticles were fabricated by ball milling method. The neat LDPE and its composites were characterized by several experimental techniques such as DSC, SEM, BDS, AC breakdown, and erosion test to better understand the effects of Si/SiO2 nanoparticle on thermal and dielectric properties of the composites. The results...
The development of advanced dielectric materials with high thermal conductivity is of crucial importance in modern electronic and power equipment systems. Herein, multilayer graphene nanosheets/epoxy nanocomposites with enhanced thermal conductivity were fabricated by solution blended processes. It was found that the incorporation of graphene nanosheets had little impact on thermogravimetric properties...
In many cases it is important to measure the temperature and the thermal conductivity of an object by contact. Examples include sensors in robot hands, and sensors to measure material properties during manufacturing. In this paper, we demonstrate the ability to measure the time-of-flight (TOF) as a function of time after mechanical contact to the transducer, and show that the rate of TOF change can...
A novel and low silver content isotropic conductive adhesive (ICA) has been developed and characterised. The conductive particles are based on a silver coated polymer sphere. The thermal properties of the ICAs have been investigated by two different characterisation techniques based on a steady state method and a contactless transient method. Results show that the thermal conductivity is strongly...
This work deals with an overall concept of a 3D-stack enabling to produce a directly pluggable high voltage power LED. Using a dedicated silicon vehicle test, a thermal study is carried out with an extensive thermal modelling, optimization, assembly process and Infrared thermal characterization. It is shown that the main thermal issues are due to the presence of the flip chip interconnection layer...
Specific properties of porous media such as thermal conductivity and wicking of liquid into the porous structure are of great importance to many applications. Typically, such porous structures are found in two-phase devices, such as heat pipes (HPs). In this study, we have experimentally analysed the effective thermal conductivity and the wicking of different liquids into a stainless steel 316L porous...
Thermal simulations are a powerful tool for the development and design of new electronics to predict their thermal behaviour during operation. To obtain accurate thermal simulations the knowledge of thermal properties of all the materials integrated in electronic devices is essential. Most materials show a decrease of thermal conductivity and thermal diffusivity with increasing temperatures, which...
In the joint project SMARTHERM the applicability of vertically-aligned carbon nanotubes (VA CNT) is main subject of interest. Target is the implementation of a VACNT layer as functional thermal interface material into an RF package to prove this promising technology's feasibility. This paper presents the approach the SMARTHERM consortium has taken so far. Beginning with a general motivation why to...
The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk...
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