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Life prediction of insulated gate transistor is often based on the damage of unilateral factors such as solder layer or bonding wire, and there is little mention of the relationship between the damage and the increase of thermal resistance. In this paper, firstly the damage of the modules in different working conditions is quantified and compared based on the fuzzy theory, and the relationship between...
Thermal interface materials (TIMs) are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistance (<1 mm2-K/W). However, due to coefficient of thermal expansion mismatches between various layers of a package, thermomechanical...
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