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This paper discusses measurement of temperature on busbar connection based on contact resistance and plating material in relation to the value of contact resistance. This study is intended to prevent failure when busbar connection is attached. The failure of the electrical connection can occur due to bad contact so that the contact resistance is increased, high losses, overheating, and it can even...
An on-chip buck converter with 3D chip stacking is proposed and the operation is experimentally verified. The manufactured converter achieves a maximum power efficiency of 62% for an output current of 70mA with a switching frequency of 200MHz and a 2x2mm on-chip LC output filter in 0.35mum CMOS. The use of glass epoxy interposer to increase the maximum power efficiency up to 71.3%, and the power efficiency...
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