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Residual stress is the most concerned issue in wafer grinding process, because it affects wafer performance and can induce wafer warpage. In this paper, the residual stress in wafers machined by different processing parameters is measured by Raman Spectroscopy. The effects of wheel feed rate, wheel rotating speed and wafer rotating speed on residual stress are investigated. Radial distance as a dimensional...
On the basis of the surface grinding-hardening test, the microstructures and property of the grinding-hardened layer depth of 40Cr steel were studied. The results show that under the coupling actions of the thermal and mechanics during the grinding hardening process, there are no remarkable effects of the grinding conditions upon the microstructure and microhardness value in high-hardness area of...
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