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The impact of singularity points on stress distribution in piezoresistive module is investigated by means of FEM simulation. Strong influence of singularities on stress distribution in silicon-glass interface is presented in this paper.
Large thermal mismatch stress can be introduced in 3D-Integration structures employing Through-Silicon-Via (TSV). The stress distribution in silicon and interconnect is affected by the via diameter and layout geometry. The TSV induced stress changes silicon mobility and ultimately alters device performance. The mobility and performance change differs in nand p- silicon and is a function of the distance...
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