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Adsorption of humic acid (HA) and Cu(II) onto cetyl pyridinium bromide (CPB) modified zeolite was investigated in single- and binary-adsorbate systems. The equilibrium adsorption data of HA and Cu(II) onto CPB modified zeolite in the single-adsorbate system were analyzed by the Langmuir and Freundlich isotherm models. The equilibrium adsorption data were well described by the Langmuir isotherm model,...
Self assembled monolayer (SAM) of alkane-thiol of 6-carbon (1-hexanethiol, C6) chain length is applied on Cu surface (deposited on Si substrate) and examined carefully. Firstly, the ability of SAM adsorption onto Cu surface is confirmed by the sharp rise of water contact angle (CA) on the surface. Next, the thermal stability of SAM when it is stored in different environments is studied. The CA decreases...
The catalytic hydrolysis of dimethyl ether (DME) over H-ZSM-5 was studied by experimental and theoretical studies. We observed from the pack-bed reactor that this reaction yields methanol as product at low temperature (<;300°C), but produces other carbon-containing species at higher temperature (>;300°C). However, these observations cannot give the details of the reaction mechanisms. To clarify...
The effect of solution temperature and the determination of the kinetic parameters of methylene blue (MB) adsorption onto cereal chaff were performed to understand the adsorption mechanism. The pseudo-second order kinetic model was fitted to the experimental data and found it was good to predict the adsorption behavior using nonlinear regressive method, suggesting that the mechanism may be a chemisorption...
Phosphine (PH3) is one of highly toxic air pollutants, commonly produced in phosphorous chemical industry. In order to utilize high concentration CO in yellow phosphorus tail gas, metals (Cu, Fe and Ce) loaded activated carbon adsorbents were prepared for the adsorption of PH3 in this study. The operating conditions, such as oxygen content, adsorption temperature and space velocity, which influenced...
This paper studies how chemical modification influences the Saccharomycescerevisiae adsorption on copper ion and the desorption of nitric acid, and carries out infrared spectrum analysis of native, adsorbing and desorbing saccharomyces cerevisiae. Results show that carboxyl and amino group in Saccharomycescerevisiae play an important role in the process of adsorbing Cu(II). The adsorption on Cu(II)...
A by-product oil shale ash from Huadian was treated with 5 mol/L nitric acid in order to enhance its adsorption capacity. The acid-treated oil shale ash was used as a low cost adsorbent to remove of cadmium from aqueous solutions. The adsorption capacity of samples to remove of cadmium was evaluated by a series of experiments, and the test results indicated that the adsorption capacity was found to...
One reliability concern, when soldering to a Cu surface finish, is the sporadic mechanical degradation of solder joints due to the formation and growth of voids within the interfacial Cu3Sn intermetallic compound (IMC) layer and at its interface with the Cu pad structure. Excess organic impurity incorporation during Cu electroplating has been shown to cause this problem. The level of impurity incorporation...
The preparation of magnetic chitoson bead by chemical conversion method has been investigated, and the IR has been used for ensuring the structure of the magnetic chitosan bead. The effects of various factors on the adsorption of Cu(II) are discussed including pH, adsorption time and adsorption temperature. The best adsorption conditions are pH 5.5, adsorption time 60 min, adsorption temperature 30degC...
Put dead immobilized beer yeast into column of continuous-upflow reactor, study adsorption characteristics on Cu2+ through axial-magnification and axial-radial-magnification tests of column and industrial wastewater treatment. The results showed: with initial Cu2+ concentration 20 mg/L, in axial- magnification test and axial-radial-magnification tests, flow rates of 35 mL/min and 100 mL/min were optimal...
Feasibility for 32 nm node interconnect is depended on porous dielectric process technology. Self-assembled porous silica as a recent highest porosity material (50%) was successfully introduced into 200 nm pitch low-k/Cu damascene. The key technologies obtained in this work were novel rapid silylation hardening process with low temperature adsorption followed by rapid annealing, and reliable pore...
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