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Large band gap materials such as diamond (5.5 eV) and AlN (6 eV) offer the possibility of making MEMS structures out of a single material by varying the doping level to achieve the semi-conducting, metallic and insulating (undoped) properties needed in a typical MEMS structure. Polycrystalline diamond (poly-C), which has recently been used in the fabrication of BioMEMS, RFMEMS, and MEMS packaging,...
The multi-material MEMS fabrication process often requires a larger number of masks making it more expensive as compared to single-material MEMS (SMM) technology. By varying the doping level in poly-C, semi-conducting, metallic and insulating (undoped) properties are achieved that are needed for poly-C SMM. However, the development of diamond-based SMM technology faces a number of challenges including...
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