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3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
In this paper, we evaluate network performance of non-acknowledged packet transfer in relatively large IEEE 802.15.4 network. Network under consideration contains six interconnected IEEE 802.15.4 beacon enabled network clusters in triangular topology using slave-slave (SS) bridges with CSMA-CA access. We investigate the interactions among local nodes, local bridges and remote bridges. Simulation results...
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