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In this paper, thick film chip resistors with two different types of solder alloys namely SnPb and SnAgCu have been evaluated for the effects of the solder alloy elemental composition on the solder joint failures under cyclic temperature loading conditions. The creep properties of both solders have been modelled using the Garofalo equation and the creep strain energy density has been extracted and...
Along with more and more use of high density plastic ball grid array (PBGA) in portable electronic products and military electronic equipments, the vibration fatigue reliability of solder joints for PBGA becomes a critical concern. In this paper, a quarter 3D symmetric model was developed by ANSYS software, then modal analysis of PCBA assembly and random vibration response analysis of mixed solder...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
In this paper, according to the condition B in the drop test standard of JEDEC, create 3D finite element model of VFBGA (very-thin-profile fine-pitch BGA) packages in drop and impact, the material model of solder joints can be indicated by Cowper-Symonds model obtained from experiment data, taking into the consideration of strain rate and temperature effect. Comparing with traditional elastic for...
The solder joint fatigue life of flip chips and ball grid array packages has been extensively studied and published. However, there are only a few published papers available on the solder joint reliability of a non-leaded, surface mounted package such as the MLPQ (Micro Leadframe Quad Package). In this paper, a non linear Darveaux's solder joint fatigue model has been used to predict the fatigue life...
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