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Conductive adhesives have been widely used in die mounting and component terminal bonding in certain types of hybrid circuits for a number of years. ECA (Electrically conductive adhesive) is an alternative to lead-free solder for certain specific applications in electronic products. Low processing temperature, fine pitch, flexible process steps, and no flux residues are some of the major advantages...
This conference paper focuses on the practical measurement of the reliability of the LF solder connection SMT mounted components on PCB. For measuring of the reliability a special printed boards with various footprints and Sn -HAL, immerse Sn and galvanic Au surface finishing were designed. Printed boards with vapour and wave soldered components underwent temperature cycling and failures (cracks)...
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