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A complete halogen-free test vehicle was achieved by assembling five ball grid array (BGA) components with daisy-chain on an 8-layer high density interconnection (HDI) printed circuit board with a low-halide Sn1.0Ag0.5Cu (SAC105) Pb-free solder pastes for reducing the formation of Ag3Sn. Afterward a board-level cyclic bending test was enforced on the as-reflowed assemblies according to the JESD22-B113...
Semiconductor packaging development for high volume consumer products poses many unique challenges across several technical disciplines in order to deliver the performance, cost, and reliability targets demanded in today's markets. In this paper, we will focus on the challenges around implementing compact Plastic Ball Grid Array (PBGA) package solutions for semiconductor devices considering the interdependencies...
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