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Many polymer based materials, such as molding compound, are commonly used in plastic encapsulated packages. In spite of many advantages, most of them, however, are hydrophilic and absorb moisture when exposed to a humid environment. This induces swelling and deformation mismatches in a package and leads to failure in some cases. Polymer materials swell upon absorbing moisture, while the adjacent non-polymeric...
This paper addresses the influence of the viscoelastic material properties of adhesives on the functionality of SHM (Structural Health Monitoring) sensor applications. Adhesives behave viscoelastically and show a strong temperature and time dependency of their mechanical properties. Creep processes increase the deformation under mechanical load and relaxation can decrease the stress in the adhesives...
An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage. In order to be able to judge the risk for interface fracture, the critical fracture properties of the interfaces being applied should be available,...
The use of temperature and time dependent material parameters is state-of-the-art in mechanical engineering. An advanced measurement method for the determination of moisture dependent parameters for micro and nano scale samples was developed. In combination with FE-analysis, this tool (involving time, temperature, and humidity) ensures a sure deployability. The present paper deals with the influence...
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