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Forced convection of liquids along with phase change heat transfer will be necessary for cooling electronic devices of the future with heat fluxes in excess of 1 kW/cm2. However, electrical and chemical compatibility of the liquid and electronic components pose significant constraints on the implementation of most liquid coolants. These constraints have led to the use of fluoroinerts and Novec fluids...
Chip stacks are a crucial building block in advanced 3D microsystem architectures and can accommodate shorter interconnect distances between devices, reduced power dissipation, and improved electrical performance. Although enhanced conduction can serve to transfer the dissipated heat to the top and sides of the package and/or down to the underlying PCB, effective thermal management of stacked chips...
Saturated pool-boiling experiments at one atmosphere and sub-atmospheric pressure assess the utility of fine filament screen-laminate enhanced surfaces as effective bubble nucleation sites and bubble generators. Experiments were conducted on vertically oriented 4 cm2 copper test surfaces in saturated distilled water at pressures of 0.2 atm., 0.3 atm., 0.5 atm., and 1 atm. Boiling performance characteristics...
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