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The paper aims to understand the line-type solder joints electromigration phenomenon in the compositional solder joint system. The current density of 1.0×104 A/cm2 at room temperature was researched. The two kinds of solder joints changed their morphology at both anode sides and cathode sides after current stressing. For structure compositional solder joint, Bi layers formed in the anode side, which...
This work focused on the electromigration (EM) behavior of the Cu/Sn-58Bi/Cu solder joint affected by the large void formation. The as-reflowed one-dimensional solder joint was stressed with current density of 5×103 A/cm2 at 80°C continuously for 144h. The microstructural evolution was observed and analyzed by SEM. Results indicated that the abnormal Sn/Bi phase segregation was observed at the cathode...
Insight is given on improved behaviors of the programmed NiSi polygated electrical fuse (eFuse) during the high temperature storage (HTS) test. By using a noble transmission electron microscopy (TEM) that includes scanning transmission electron microscopy (STEM), energy dispersive x-ray spectrometry (EDS), electron energy loss spectrometry (EELS) and nano-beam electron diffraction (NBED), microstructural...
The migration issue of PackPackage-on-Packageage-on-package (PoP) is investigated in this article. The migration phenomenon can be amplified as the density of solder bumps increases, while the paths are very finer as well in PoP. These migration effects were first evaluated by three dimensional finite element simulations in ANSYS in a previous article, in which the bottom of the bump was found out...
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