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This paper theoretically and experimentally assesses the board-level reliability of glass-based 3D Integrated Passive Device (IPD) with TGV-based inductor capacitor (LC) filters in thermal cycling test. Important failure modes such as wellknown solder joint cracking and TGV failure as well as other failure modes such as glass cratering are investigated in this work. Through finite-element modeling,...
In this paper, the drop impact reliability of the 3D embedded wafer level package (eWLP) was studied by the experiment and finite element simulation. The drop impact reliability test of the 3D eWLP test vehicle was conducted under the loading of 1500 g within 0.5 ms. The failure mechanisms were identified through the failure analysis experiment. The experimental results show that the failure modes...
In this paper, a method of solder joint thermal fatigue life analysis using transient thermal analysis is introduced, and also a case study of temperature shock test to an CPU module. The results show that this method obtained the temperature load under actual use, which is closer to engineering problems. The module's maximum temperature variation range is 50D-132D. Under the temperature load, the...
Models and results are presented of thermomechanical simulations of an RF-MEMS 0-level package based on wafer bonding by soldering. For moderate realistic loads most relevant responses are accetable. However, residual stress and thermal expansion of the solder material lead to deformations beyond the yield strain in corners of solder cross sections. This phenomenon can only be addressed by technology...
The effects of the moment, axial force and shear force induced during drop impact on the peeling stress of the solder joints were investigated by a 2-D beam model and a 3-D solid model of board level electronic package. It shows that the peeling stress is dominated by the bending stress and the maximum occurs at the PCB end. Results of the two models indicated that in the solder joint array only a...
In this paper, according to the condition B in the drop test standard of JEDEC, create 3D finite element model of VFBGA (very-thin-profile fine-pitch BGA) packages in drop and impact, the material model of solder joints can be indicated by Cowper-Symonds model obtained from experiment data, taking into the consideration of strain rate and temperature effect. Comparing with traditional elastic for...
The system-in-package (SiP) is among the popular designs which meet the trend of integrated circuit (IC) development. The SiP structure investigated in this study includes seven sub-chips attached to the chip carrier, and polymer was applied around the chips. The polymer is an exceptional stress buffer layer reducing the maximum shear stress in the solder joints, but it also affects the copper interconnection...
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