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Thermal shock test was performed on the SnAg3.8Cu0.7 (SAC387) solder bump interconnecting AlN and Cu substrate. Finite element modeling (FEM), cross-polarized light microscopy, scanning electronic microscopy (SEM) and EBSD were used to analyze the failure mechanism of them. It was realized that during thermal shock, the areas with higher stress would suffer from more serious IMC coarsening and then...
In this paper, a new application of 4-point cyclic bending test for the solder joint reliability evaluation is discussed. In light of the long cycle time of thermal cycle testing, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. The 4-point cyclic bending test is considered a good candidate in this study. The thermal cycle test and 4-point...
Solder joint crack is a common failure mode of printed circuit board assembly (PCBA) for electronic products. In order to investigate the crack behavior of fine-pitch SMT solder joints, accelerated thermal cycling (ATC) up to 1500 cycles was performed on advanced PCBAs with low-profile thin small outline package (TSOP). The functional examination result shows that the failure rate of TSOP solder joint...
The analysis process and methods of a failure BGA solder joint have been studied by a failure analysis case for an actual BGA package sample with XRD, cross section analysis and SEM&EDS analysis. The analysis results show that the cracks are the main failure causes of the BGA solder joints. The position of cracks appeard between the IMC and PCB pad and the interface of solder and IMC. The main...
Bonding-induced strain is shown to have significant impact on the performance of distributed feedback (DFB) lasers mounted p-side up on AlN carriers using AuSn solder. Degree of polarization (DOP) of photoluminescence was used to estimate top-side longitudinal strain profiles in InP chips soldered to AlN carriers. Asymmetric strain profiles were revealed, the orientation of which are shown to be dependent...
Due to the advantages of small-footprint, short-lead, high performance, high-packaging-density and thin profile, flip-chip-on-board (FCOB) technology is becoming an attractive choice in todaypsilas high density electronic packaging industry. With the trend toward lead-free and miniaturization in consumer electronics, the fatigue reliability of the small size lead-free FC solder joint on low cost PCB...
Solder joint strength at high strain rates is a critical reliability requirement for portable electronic devices. Experimental observations showed low shear rate tests of solder joints cannot be used to accurately predict the mode of deformation and failure behaviors under high speed impact condition. Due to strain rate effect, brittle failure of solder joints under dynamic loadings may not take place...
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