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Warpage, high stress in dies and solder joints are introduced in assembly process of a package-on-package component. In this paper, a finite element approach is proposed to predict the warpages and stresses during the full assembly process. By the techniques of element die and birth as well as restart method, the approach is able to transfer the stress and warpage in one process to the next so that...
Physics-of-failure (POF) prognostic model is a key technique of prognostics and health management (PHM) which plays critical roles for remaining life assessment of the products. The recent developments in POF based stress-damage model on thermal fatigue and vibration fatigue of solder joints were summarized. Numerous fatigue stress-damage models were proposed such as stress-fatigue model, strain-fatigue...
Due to the widespread use of portable electronics, there is a significant increase in interest in exploring the impact reliability of electronic packaging during impact shock. Currently, the test standard used for board level drop testing is JESD 22-B111, which specifies the impact pulse (i.e. 1500 G at 0.5 ms) as a criterion for drop testing. However, this may not mimic the actual product testing...
The thermal-mechanical reliability of solder joints has been a key issue in the reliability assessment of electronic packaging. The recent developments in constitutive model of solder joints are summarized. Numerous constitutive models are proposed such as elastoplastic model, creep model, separated viscoplastic model, uniformed viscoplastic model and constitutive model based on fracture mechanics...
Predictive modeling tools and techniques, whether computer-aided, such as, e.g., finite-element analysis (FEA), or analytical (ldquomathematicalrdquo), are currently widely used in physical design and reliability evaluations in electronics engineering. The implementation of these tools and techniques requires accurate input data for obtaining trustworthy output information that is intended to be used...
We examine an elongated bi-material adhesively bonded or soldered assembly with a continuous compliant attachment (bonding layer). The assembly is subjected to external tensile forces and bending moments applied to the ends of one of its components. We develop a simple and physically meaningful predictive analytical (ldquomathematicalrdquo) model for the evaluation of the interfacial shearing and...
It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A...
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