The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Cu-to-Cu direct bonding is one of the key technologies for 3D (three-dimensional) chip stacking. This research proposes a new concept to enhance Cu-Cu direct bonding through the control of residual stresses on bonding surface. Compressive residual stress induced by near-infrared radiation (NIR) enhances the diffusion of copper atoms and thus direct bonding. Subjected to thermal compression bonding...
This paper describes the scaling effect on the micro-machined gas-pendulum dual-axis tilt sensor from two aspects, microscale gas flow and microsystem technology, based on the design, fabrication and capability of the sensor; detailedly founds the theory model and analysis method of the sensor miniaturization in every stage whose demarcation points are 0.25 mum and 0.5 mum; simulates the gas flow...
Fe/Fe-N multilayered films were prepared by alternation of Fe sputtering at various Ar gas pressures and ECR nitrogen plasma exposure, and the structure and magnetic properties of the resulting films were investigated. Growth of columnar structures was observed in Fe film prepared at high Ar gas pressure. Fe/Fe-N multilayered films with an Fe layer prepared at low Ar gas pressure have a low Hc and...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.