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As circuit density increases and high-power applications are facilitated, thermal considerations become paramount a design concern. In this paper, a high power monolithic microwave integrated circuit (MMIC) is modeled by the fREEDA multi-physics simulator and measured for validation. While validation is the crux of any simulation model, it is known that thermal measurements accurate to a high resolution...
We determined the thermal properties of thermal interface materials (TIMs) based on carbon nanotubes (CNTs) and commercial TIMs. The thermal conductivity of different fillers such as CNTs, graphite, nano-diamond, metal, and metal oxide particles (copper and zinc oxide) at different concentrations were studied with a transient plane source technique. For measuring the thermal diffusivity with the Xenon...
3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. Key technologies for realizing 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnections. The major bottleneck for 3D integration are thermal management issues due to the reduced thermal spreading in...
Telecommunication equipment with high power density and high power consumption should be cooled sufficiently enough for its stable operation and reliability. For the thermal management of a high power telecommunication system, electronic components temperature field and cooling air flow field are simulated by a CFD program. Two levels of thermal modeling are applied due to both computational cost...
A novel method is proposed to evaluate the chip-level thermal non-uniformity of semiconductor devices by electrical transient thermal response testing. It is found that the degree of integrated chip thermal non-uniformity could be determined non-destructively by the device heating response curves.
Consideration of health management and reliability form an integral part of the design and development cycle of electronic products. In this paper real-time compact thermal models are employed as an efficient tool to monitor thermal path degradation at particular locations within the module such as interfaces between the base-plate and heatsink. The compact real-tine thermal model is used to predict...
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