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It's proved that the physical meaning of the electrical average temperature rise of series LED array system tested by electrical temperature sensitive parameter (TSP) method is the arithmetic mean of the temperature rises of all sub-LEDs in the system. Based on this relationship, a novel method to evaluate the temperature distribution of series LED systems by scan measurement and recursive calculation...
A novel method is proposed to evaluate the chip-level thermal non-uniformity of semiconductor devices by electrical transient thermal response testing. It is found that the degree of integrated chip thermal non-uniformity could be determined non-destructively by the device heating response curves.
A physical yet analytical phase change memory (PCM) model simultaneously accounting for thermal and electrical conductivities is presented. Due to the physics based nature of the model, the essential temperature from heating and cooling of PCM during operation is instantaneously updated. More importantly, the model can be applied to non-conventional circuit design technique. We show that for the first...
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