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Simple experiments were conducted to obtain surface and lamp hold temperatures of a main-stream 4W LED bulb, which is on sale in the market. Two kinds of thermal calculations were also done based on the data from measurements. The total heat dissipation rates in those two thermal calculations are close to each other, which demonstrate that the thermal calculation is feasible for thermal analysis of...
Surface mounted components are considered fine pitch if lead pitches are equal or lower than 0.65 mm (25 mils). Fine pitch Ball Grid Array (BGA) Integrated Circuits (IC-s) require special considerations for design, assembly and failure analysis. Design for Manufacturing (DfM) is a key aspect in the PCB design process. As for soldering, Vapor Phase Soldering (VPS) is an emerging reflow method for fine...
As circuit density increases and high-power applications are facilitated, thermal considerations become paramount a design concern. In this paper, a high power monolithic microwave integrated circuit (MMIC) is modeled by the fREEDA multi-physics simulator and measured for validation. While validation is the crux of any simulation model, it is known that thermal measurements accurate to a high resolution...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
Nanostructuring is one of the effective approaches to lower the thermal conductivity of materials. Nanostructured skutterudite-related compounds CoSb3, Fe0.5Ni0.5Sb3, Fe0.25Ni0.25Co0.5Sb3 and Te-doped CoSb3 were synthesized by a solvothermal route. The bulk materials were prepared by hot pressing or spark plasma sintering from the solvothermally synthesized nanopowders. The thermal conductivity values...
Cu/Co/Cu/NiFe multilayer films prepared by evaporation deposition in an ultrahigh vacuum were heat-treated in air and in ultrahigh vacuum. Heat treatment in ultra-high vacuum brought about no changes in the MR ratio or MR slope for annealing temperatures less than 400C. The thermal stability in air was limited by gradual oxidation from the surface, and thermal stability up to 250??C was verified....
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