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The modeling and simulation of via's effect on the data transferring or high frequency signal path and device performance have been one of the major concerns in the designing and testing of multilayered electric interconnects in applications like highly integrated system-in-package (SIP) and high-speed circuitry design. The authors of this paper explore the 3D full-wave modeling of through Si vias...
A wideband and compact filter design for common-mode noise suppression in high-speed differential signals is proposed based on two U-shaped and one H-shaped coupled patterned ground structure. An equivalent model of three coupled LC resonators to predict the common-mode suppression characteristics is also developed with good agreement to the full-wave simulation and measurement result. A test sample...
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