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Three-dimensional system integration using Cu through-silicon-via (TSV) technology enables vertical interconnection of stacked dies. However, the large statistical distribution of plastic Cu extrusion, also known as Cu pumping, presents a serious reliability concern. Traditional finite element method (FEM) based thermo-mechanical modeling that neglects microstructure has been extensively attempted...
Before going into detailed design of an electrical machine some assumptions or estimations are often sufficient. One aspect is the winding layout and the copper filling factor. For a rapid approach this article presents an algorithm for the filling factor calculation for random wound windings. Based on the geometry of the slot the maximum number of wires per slot is calculated for different magnet...
In present study, an interesting phenomenon of solder bridging presents in fine pitch BGA device is reported. The failure mechanism is investigated by solder formation modeling, and examined by experimental results of multi-factors evaluation. Results show that the risk of adjacent joints bridging is highly influenced by printed circuit board design attribute. A mathematic model is applied to describe...
In present study, an interesting phenomenon of solder bridging presents in fine pitch BGA device is reported. The failure mechanism is investigated by solder formation modeling, and examined by experimental results of multi-factors evaluation. Results show that the risk of adjacent joints bridging is highly influenced by printed circuit board design attribute. A mathematic model is applied to describe...
It is well-known that thick wires energized with high-frequency currents show the effect, that the current mainly flows near the surface of the wire. This effect is quite well described in literature for round wires, for rectangular wires no description of similar simplicity could be found. This effect may be relevant for future electric drives, e.g. in the automotive industry. Therefore, the skin...
Low-k dielectric breakdown and stress migration have emerged as new sources of wearout for on-chip interconnect. This article analyzes statistical data from a 45-nm test chip and constructs a methodology to determine the lifetime of low-k materials under process variations.
This paper describes a general method and a model for lifetime extrapolations which can account for stress non-uniformities caused by complex geometries or also geometrical variations due to the manufacturing process. The effect of these non-uniformities combined with different materials involved in a stacked geometry on the overall back end of line (BEOL) dielectric reliability are considered theoretically...
In this paper, the layered structure ZnO/Quartz (90deg rotated ST-cut) is investigated theoretically and experimentally. Both waves, Rayleigh and Love, are analyzed. Dispersion curves of phase velocities, electromechanical coupling coefficient (K2) and temperature coefficient of frequency (TCF) were calculated as a function of normalized thickness ZnO film (khZnO = 2pihZnO /lambda) and the optimum...
This paper identifies three distinct types of losses associated with high dielectric materials in a rf electric field, specifically in a rectangular TE102 microwave cavity. Various orientations of high dielectric structures relative to the electric field polarization have been studied using ansoft high frequency structure simulator (HFSS) (version 9.0, Pittsburgh, PA) and Computer Simulation Technology...
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