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Tin-plated copper structure was widely applied in the electronic products. With the development of the electronics industry, the integration degree increased and the component size reduced obviously. The conventional tin plating technology met the micro-structure challenge; it may not be used in advanced electronic packaging process. The electroless tin plating technology could solve this problem...
In this paper, tin whisker behaviour of electroplating tin coating was studied in different environments. Different thickness of electroplating tin coating on copper substrate had been tested. Two different environmental conditions had been applied :one temperature tests (70 °C)and one external force tests(70 °C /17.5N). The growth of tin whisker was studied by using scanning electron microscopy (SEM)...
The effect of thermal aging temperature and external tension on the formation and growth of tin whisker from Sn electroplating coating was studied by use of scanning electron microscopy(SEM)in this article. It is shown that the unbiased temperature accelerates the formation and growth of tin whisker. However external tension do not obviously promote the formation and growth of tin whisker. After coating...
The effect of thermal aging temperature and external tension on the formation and growth of tin whisker from Sn electroplating coating was studied by use of scanning electron microscopy(SEM)in this article. It is shown that the unbiased temperature accelerates the formation and growth of tin whisker. However external tension do not obviously promote the formation and growth of tin whisker. After coating...
In this paper, tin whisker behaviour of electroplating tin coating was studied in different environments. Different thickness of electroplating tin coating on copper substrate had been tested. Two different environmental conditions had been applied :one temperature tests (70 °C)and one external force tests(70 °C /17.5N). The growth of tin whisker was studied by using scanning electron microscopy (SEM)...
Micro-scale wear testing of soft materials, such as copper, aluminum, magnesium alloy, AISI10045 steel et al., was investigated with multifunctional micro-wear tester by self-development. And it was also compared with that of Ni60B coating and TiN coating with higher hardness. Roughly annular regions emerged in the abrasion scars were analyzed. Problems associated with the measurement of abrasion...
A significant majority of component terminations are finished with electroplated tin. This finish offers a number of process advantages, but does have an intrinsic reliability issue. During ageing of the tin stresses can build in the finish that can result in the growth of a single crystal of tin out of the surface, a so-called tin whisker. Such whiskers can grow to a few hundred microns and cause...
This paper considers the influence of 1) humidity and 2) acidic humidity on the growth of Sn whiskers. Sn whisker morphology was observed over a six-month period. The results show that the electroplated surfaces exposed to pure humidity are populated with Sn whiskers dimensionally smaller than surfaces exposed to acidic humidity. Variables analyzed include surface condition, Cu-Sn inter-metallic formation...
To evaluate tin-whisker growth during thermal cycling tests, a simulation technique for calculating the change in atomic-density distribution of tin caused by a change in temperature, which induces a stress gradient in polycrystalline tin plating, was developed. This technique uses the finite-element method (FEM), molecular-dynamics (MD) simulation, and X-ray diffraction (XRD). Specifically, an FEM...
Thales Components & Subsystems as a manufacturer of high voltage components and vacuum tubes has developed ceramics coating in order to minimize multipactor effect. Two prototypes of TTF III couplers have been manufactured and tested, one with a Cr2O3 coating, the other one with a TiN coating.
Gradually diminishing solderability and potential risk of whisker growth are two major concerns in using immersion tin as a final finish for printed wiring boards. Both phenomena are attributable to the spontaneous formation of intermetallic compounds (IMC) of Cu6Sn5 and Cu3Sn between the tin coating and copper substrate. The formation of IMC consumes the free tin in the coating that is essential...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
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