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Strain engineering has become an important tool to allow the semiconductor industry to meet roadmap requirements for device performance in the face of limits to device scaling. In addition, strain and/or lattice distortion through chemistry or mechanical stress, can have significant effect on mechanical, electrical and magnetic properties in a wide range of materials. Therefore, determination of strain...
Extremely high strength in microcomposite Cu-Nb wires is associated with ultra-fine-scale microstructure. The extended interfaces between ribbon-like niobium filaments and copper matrix contain the areas of semi-coherent interfaces that are apparently the main reason of significant level of residual stresses observed in microcomposite Cu-Nb wires. The analysis of nonequilibrium of such microstructure...
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