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Smaller form factor, thermal/electrical efficiency and low-cost manufacturing are characteristics of the wafer level chip scale package (WLCSP) which had been widely used by market demand especially in handheld and portable applications in past several years. However, the challenge of board level reliability tests such as drop test, thermal cycling loading test to limit package size for higher I/O...
A nonlinear finite element method (FEM) analysis technique is developed to simulate the viscous behavior of geogrid-reinforced sand during loading. In the FEM simulations, the viscous properties of sand and polymer geogrid are described in the framework of a unified nonlinear three-component elasto-viscoplastic model. The results from the plane-stain-compression (PSC) tests on the geogrid-reinforced...
The changeover from eutectic Sn-Pb solders to lead-free solders has been driven by environmental concerns and market accessibility in the last few years. Though a number of creep constitutive laws of lead-free solder have been reported due to the importance of creep in solder joint failure in the electronic packaging, these constitutive laws often show great variations across the applicable stress...
The piled wharf on slope may impacted by the deformation of soft soil foundation, the lateral displacement of pile cap would increasing because the deformation of soft foundation, which would threaten the safety of wharf structure. The creep is one of the important factors, so it is meaningful to research the creep characteristics of slope. In this paper, the deformation damage of piled wharf and...
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