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Tin-plated copper structure was widely applied in the electronic products. With the development of the electronics industry, the integration degree increased and the component size reduced obviously. The conventional tin plating technology met the micro-structure challenge; it may not be used in advanced electronic packaging process. The electroless tin plating technology could solve this problem...
This paper mainly studied the effect of storage time on solderability of two kinds of Sn plating of flat gull wing leads on plastic package IC component. Design the aging test, and then use Xray photoelectron spectroscopy (XPS), wetting balance test and data analysis, to obtain storage of coating aging degree and the change of the terminal wetting balance. Consequently, provided the criterion for...
The effect of thermal aging temperature and external tension on the formation and growth of tin whisker from Sn electroplating coating was studied by use of scanning electron microscopy(SEM)in this article. It is shown that the unbiased temperature accelerates the formation and growth of tin whisker. However external tension do not obviously promote the formation and growth of tin whisker. After coating...
The effect of thermal aging temperature and external tension on the formation and growth of tin whisker from Sn electroplating coating was studied by use of scanning electron microscopy(SEM)in this article. It is shown that the unbiased temperature accelerates the formation and growth of tin whisker. However external tension do not obviously promote the formation and growth of tin whisker. After coating...
Gradually diminishing solderability and potential risk of whisker growth are two major concerns in using immersion tin as a final finish for printed wiring boards. Both phenomena are attributable to the spontaneous formation of intermetallic compounds (IMC) of Cu6Sn5 and Cu3Sn between the tin coating and copper substrate. The formation of IMC consumes the free tin in the coating that is essential...
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