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In this study, titanium (Ti) added Sn58Bi solder alloys were synthesized. Microstructure evolution and mechanical property change during 1008 h thermal aging were compared with those of eutectic Sn58Bi and Ti-added Sn58Bi alloys. According to the results, yield strength (YS) and ultimate tensile strength (UTS) decreased, while even after aging, the Ti-added Sn58Bi alloy maintained the highest YS and...
The solder joint's volume and interfacial reaction during the soldering significantly affect its solidification behavior and microstructure feature; further, the microstructure of the solder matrix and the intermetallic compounds (IMC) have a direct impact on the performance and reliability of the solder joint. In this study, the effects of the solder volume and interfacial reaction on the undercooling...
The solder joint's volume and interfacial reaction during the soldering significantly affect its solidification behavior and microstructure feature; further, the microstructure of the solder matrix and the intermetallic compounds (IMC) have a direct impact on the performance and reliability of the solder joint. In this study, the effects of the solder volume and interfacial reaction on the undercooling...
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC)...
Reliability of SnAgCu solder joints under mechanical stress is not proven, in particular for Aeronautic and High Performance (AHP) products. They are subjected to high temperatures, severe mechanical stresses and long-term mission profiles. This work is comprehended within a larger study, which has as objective the characterization of the SnAgCu alloys mechanical behaviour at the solder joint scale...
To investigate the effect of the stand-off height (SOH) on the microstructure and mechanical behavior of certain solder joints, Cu/Sn9Zn/Cu solder joints with SOH of 100??m, 50??m 20??m and 10?? were prepared and studied. It was found that as the SOH is reduced, Zn content in solder bulk has a rapid decrease due to consumption by the reflow reaction, hence, the microstructure of solder bulk is changed...
Electrochemical migration (ECM) of lead-free solder joints were investigated by water drop test method. Nine types solder pastes were employed to compare the ECM susceptible. The effects of applied voltage, electrodes spacing and flux residue on the ECM were in-situ observed. The microstructure and composition of the growing dendrites during ECM were detected. The results revealed that higher voltage...
This study investigates the effect of the stand-off height (SOH) on the microstructure and tensile fracture mode of Cu/Sn9Zn/Cu solder joints. Solder joints with SOH of 100 mum, 50 mum and 20 mum are studied. It is found that as the SOH is reduced, Zn content has a rapid decrease in the solder bulk, while, the intermetallic compound (IMC) layer proportion increases. SOH of the solder joint also has...
In this paper, the behavior of BGA solder joints microstructures was studied as a function of Ni doping in SAC solder. Three kinds of solder compositions were selected including Sn3.0Ag0.5Cu, Sn1.0Ag0.5Cu and Sn1.0Ag0.5Cu0.02Ni to value the influence the effect of Ni doping, OSP and Au/Ni pad was employed on the PCB side. Emphasis was placed on studying the effect of low level doping with Ni on the...
Two types of printed conductors were studied for their effects on the solderability and reliability of printed electronics. The metal particles of the studied printed conductors were copper and silver and the bonder was phenol resin. The test vehicle was a 6 x 25 mm FR4 coupon, where the printed conductors were formed on it. Dip and look test results indicated that printed silver heavily leached and...
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