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As semiconductor technology moves closer to the ultimate physical limits for scaling of devices that utilize electrons as information bearing particles, many new opportunities for research in the physical sciences are emerging. If we look beyond the limits of scaling electron devices, many more challenging research opportunities exist in the areas of physics of information carriers and physics of...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
Sublinear signal propagation delay in VLSI circuits carries a far greater penalty in wire area than is commonly realized. Therefore, the global complexity of VLSI circuits is more layout dependent than previously thought. This effect will be truly pronounced in the emerging wafer scale integration technology. We establish lower bounds on the trade-off between sublinear signalling speed and layout...
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