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In this paper, we proposed a fabrication method of a double-layer split-ring-resonator (SRR) array for metamaterials in the terahertz (THz) frequency range. Our fabrication method leads to three-dimensional metamaterials.
This paper presents for the first time a hybrid silicon-organic packaged mm-wave antenna, that is flip-chip bonded to a 400 µm thick silicon substrate through gold bumps and a non-conductive film (NCF) adhesive layer. The antenna was made on RO3003™. Two different antennas were designed, at 60 and 80 GHz respectively. It is demonstrated that the silicon substrate can be successfully integrated into...
A 53 dB gain limiting amplifier for OC-192 and 10 GbE applications is developed in a 50 GHz fT SiGe SOI complimentary bipolar process, and has 5 mV pk-pk sensitivity, 1.25 V pk-pk maximum input signal, 14 ps (20/80%) rise/fall times and 450 mV pk-pk output into matched differential 50 Ohm loads, consuming 430 mW on a 3.3 V supply. Input Cherry-Hooper gain stages limit the -3 dB bandwidth to 11 GHz...
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