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This paper reports the impact of ageing on the cohesive and adhesive strength of overmould materials used in electronic packages. For so-called harsh environment applications, the overmoulded package operates in an ambient at a continuous temperature of 175°C, or sometimes even 200°C. At these high temperatures, it can be expected that the overmould material and its interfaces degrade. In order to...
Electronics packaging must be designed to meet the increasing requirements of the microelectronics industry. Future packages will have an even higher number of I/O's and pitches down to 20 microns resulting in high dissipation losses and extreme current densities. When using conventional materials, design engineers will face physical barriers and limitations in performance and new material solutions...
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