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The simulation of the temperature field in the diamond-polymer matrix system was conducted. The influence of the matrix's thermal conductivity on the temperature field was explored. Ways of reducing the thermal load on the tool were suggested.
Electrical insulating polymers usually incorporate inorganic fillers to achieve specific electrical, mechanical, thermal properties and reduce cost. In this exploratory work, we have studied the thermal properties, at 40degC, of epoxy resin composites with different filler such as: boron nitride, alumina, diamond, silicon carbide, and silicon nitride, with particle size ranges from micro to nano....
The thermal characteristics of thermally conductive underfill in flip chip package was studied. To enhance the thermal conductivity of underfill, the epoxy was mixed with thermally conductive fillers, such as silica (1.5W/mK), alumina (36W/mK), or diamond (2000W/mK). Coefficient of thermal expansion (CTE) was changed by filler and its content, and CTE was 28 ppm for 60 wt% silica, 39 ppm for 60 wt%...
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