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A composite material from particles of synthetic or natural diamond in a copper matrix, having a thermal conductivity (TC) of 500–900 W m −1 K −1 , is obtained by capillary infiltration. A tungsten coating of 100–500 nm thickness is first applied to the diamond powder. The carbidization of the coating during annealing and melt infiltration is studied by X-ray diffraction. Measurements...
GaN based RF devices are pushing the threshold on existing thermal management materials. High heat fluxes and the need for a heat spreader material with low CTE that is a close match to the device material (e.g. Silicon Carbide) is driving the need for higher thermal conductivity (>;450W/mK) solutions. Aluminum diamond has been developed to meet this need with a CTE of 7.5ppm/K and thermal conductivity...
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