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A Cu/Ni UBM and Sn-2.5Ag lead-free solder for 20 μm pitch micro-bump was successfully fabricated via consecutive electroplatings of Cu, Ni, and binary SnAg. Materials characterizations such as Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), Electron Probe Micro-analyzer (EPMA), and X-ay Photoelectron Spectroscopy (XPS) were carried out to obtain relevant materials properties. We observed...
Both the static and fatigue strengths of electroplated copper thin films were measured under uni-axial stress. The mechanical properties such as the yield stress, fracture elongation and Young's modulus of each film were quite different from those of bulk copper depending on their micro structure. The fracture surfaces were observed by SEM after the fatigue test. It was found that there were two fracture...
Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure...
Horizontal pulse-reverse plating system was employed for blind micro via (BMV) filling process. The reverse plating time, frequency, and current shape was controlled or modified to observe the influence factors on BMV filling and thickness uniformity. Pulse-reverse plating system can reduce the surface thicknesses and had good ability to filling high aspect hole. During reverse time plating, the etching...
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