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Further miniaturization of electronic systems is approaching new limits due to the failure mechanism of electromigration. Electromigration results in a transport of material in solder joints subjected to high electrical current densities. This decreases the system reliability and, therefore, it is necessary to assess and quantify this failure mechanism in solder joints. In this paper we discuss the...
Competing mechanisms of electromigration and thermomigration in flip chip SnAgCu (SAC) solder joints were studied experimentally. A daisy chain of solder joints were stressed at 2.0 times 104 Amps/cm2, 2.4 times 104 Amps/cm2, and 2.8 times 104 Amps/cm2 current density levels at room temperature. In the test vehicle, some solder joints were exposed to a combination of electromigration and thermomigration,...
Fine and ultra-fine powders are actively studied in a broad and interdisciplinary area of nanotechnology. This paper presents the complex of well-grounded solutions for direct production of nanopowders by the exploding wire method. The influence of initial conditions on the properties of powders is discussed. The basic factors are as follows: the level and the uniformity of heating, the heating rate,...
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